1-VIA was founded in late 2020 to develop high-speed, high-resolution data converters. The company has been awarded £0.5M funding from Innovate UK to develop high-speed and low-power transceiver chips targeting next-gen telecom markets.

1-VIA has a combined experience of >100 years in cutting-edge silicon design of high-speed ADCs, DACs and SerDes. The team has previously worked together delivering >30 communication chips for Cisco, Huawei, Fujitsu and Nokia, and has received >20 patents for their work in silicon in a range of technology nodes from 1um down to 7nm.

1-VIA has developed an ultra-low-power transceiver chip architecture enabling the company to achieve power savings in earlier technology nodes. The company’s chips target high-bandwidth low-latency requirements for the next-gen telecom markets.

The company also offers a range of semiconductor services from system architecture design and modelling to layout implementation and verification. Its IP portfolio includes a range of high-speed ADC, DAC, PLL, LNA, PA and other subsystems.

Suhas Rattan, Founder & CEO (previously Architect Analog/Mixed-Signal IC Design at Kandou)

Ivaylo Avramov, Founder & COO (previously Layout and Integration Manager at Kandou)

Charlie Dedic, Systems Engineering Manager (previously Senior Modelling Manager at Kandou)